Digi XBee 3 BLU Development Kit
Complete Digi XBee 3 BLU development platform to integrate compact, flexible Bluetooth Low Energy connectivity for IoT devices
The Digi XBee® 3 BLU Development Kit offer an easy-to-use Bluetooth® development platform for designers, OEMs and solution providers supporting Bluetooth 5.4 Low Energy for industrial wireless IoT connectivity. The module supports an industrial temperature range of −40 ºC to 85 ºC (−40 ºF to 185 ºF) making it robust for a variety of industrial applications.
The pre-certified modules comes in the classic XBee form factors (MMT and through-hole) offering MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Pre-certified modules and tools for development
The pre-certified modules offer MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Standard Digi XBee API frames and AT commands, as well as MicroPython and Digi XBee Studio, make it simple to set up, configure and test modules or update their functionality.
Digi XBee Bluetooth Low Energy modules are a key offering in the Digi XBee ecosystem of wireless modules, adapters, tools and software — all engineered to accelerate product and application development, deployment and management.
Built-in Digi TrustFence® security, identity and data privacy features use multiple layers of control to protect against new and evolving cyber threats. Bluetooth Low Energy also adds security via pairing & bonding, encrypted advertising along with existing XBee security including secure boot, hardware cryptographic acceleration and true random number generation.
Proven experience and expert support
Our decades of embedded experience and millions of deployed devices tell our story; Digi is a trusted solutions provider dedicated to simplifying the way OEMs design, build, deploy and maintain secure connected products.
Digi Wireless Design Services (WDS) provides additional connectivity integration support, certification assistance, and custom design and build services to get your products to market smarter and faster, and support you wherever you are along your development path.
Key features, benefits and applications
- Designed for a range of use cases, from maker projects to industrial applications
- Industrial-rated on a Bluetooth module
- Integrated MicroPython programmability for edge compute
- Bluetooth® Low Energy for beaconing, connecting to sensors and local configuration using the Digi XBee Mobile app
- Easily detect modules and connect to smart devices
- Low power consumption optimized for long battery life
- Integrated with Digi TrustFence® security framework
- Manage, configure and test with Digi XBee Studio
- Accelerate development with Digi IoT Mobile SDK
- Digi XBee API functionality and support
- Over-the-air (OTA) firmware updates with the Digi XBee Mobile app
- Complete Bluetooth Low Energy 5.4 software stack
The kit includes:
- (1) Digi XBee 3 BLU modules: chip antenna
- (1) XBIB interface board
- (1) Antenna (U.FL connector)
- Digi XBee Studio and Digi XBee Tools
- Additional documentation and examples
Digi XBee 3 BLU Development Kit
| Specifications |
Digi XBee 3 BLU |
| BLUETOOTH® PERFORMANCE |
| TRANSCEIVER CHIPSET |
Silicon Labs EFR32MG SoC |
| BLUETOOTH LOW ENERGY VERSION |
Supports Bluetooth Low Energy 5.4 and capable of interoperating with Bluetooth Low Energy 5.4 devices that support 1M and 2M PHY |
| MAXIMUM RF DATA RATE |
1 Mbps with 1M PHY and 2 Mbps with 2M PHY |
| INDOOR/URBAN RANGE* |
Up to 15 m (49 ft) |
| OUTDOOR/RF LINE-OF-SIGHT RANGE* |
Up to 300 m (984 ft) |
| TRANSMIT POWER |
+8 dBm |
| RECEIVER SENSITIVITY (1% PER) |
−97 dBm |
| FEATURES |
| SERIAL DATA INTERFACE |
UART, SPI |
| CONFIGURATION METHOD |
API or AT commands, local or over-the-air (OTA) |
| FREQUENCY BAND |
ISM 2.4 GHz |
| FORM FACTOR |
Micro (MMT), through-hole (TH) |
| INTERFERENCE IMMUNITY |
FSK (Frequency-shift keying) |
| ADC INPUTS |
(4) 10-bit ADC inputs |
| DIGITAL I/O |
13 |
| ANTENNA OPTIONS |
Micro: U.FL antenna, RF pad, chip antenna
Through-hole: PCB antenna, U.FL connector |
| OPERATING TEMPERATURE |
−40 ºC to 85 ºC (−40 ºF to 185 ºF) |
| DIMENSIONS (L X W X H) |
Micro: 13 mm x 19 mm x 2 mm (0.533 in x 0.76 in x 0.087 in)
Through-hole: 2.438 cm x 2.761 cm (0.96 in x 1.087 in) |
| MEMORY |
1 MB / 96 kB RAM |
| NETWORKING AND SECURITY |
| PROTOCOL |
Bluetooth Low Energy 5.4 |
| ENCRYPTION |
128/256-bit AES |
| RELIABLE PACKET DELIVERY |
Retries/acknowledgements |
| IDS |
PAN ID and addresses, cluster IDs and endpoints (optional) |
| CHANNELS |
40 channels |
| SECURITY |
Digi TrustFence security with secure boot and protected JTAG |
| CONFIGURATION TOOLS |
Digi XBee Studio and Digi XBee Mobile App |
| EMBEDDED PROGRAMMABILITY/td> |
MicroPython |
| POWER REQUIREMENTS |
| SUPPLY VOLTAGE |
1.71 – 3.8 V |
| TRANSMIT CURRENT |
32 mA at 3.3 V, +8 dBm |
| RECEIVE CURRENT |
13.5 mA |
| IDLE CURRENT |
7.5 mA |
| SLEEP CURRENT |
8 µA at 25 ºC (77 ºF) |
| REGULATORY AND CARRIER APPROVALS** |
| FCC, IC (NORTH AMERICA) |
Complete |
| ETSI (EUROPE) |
Complete |
| WARRANTY |
| PRODUCT WARRANTY |
1-year |
*Range figure estimates are based on free-air terrain with limited sources of interference. Actual range will vary based on transmitting power, orientation of transmitter and receiver, height of transmitting antenna, height of receiving antenna, weather conditions, interference sources in the area, and terrain between receiver and transmitter, including indoor and outdoor structures such as walls, trees, buildings, hills, and mountains.
**Visit
product certifications for latest updates.