Reflow oven profile

Two thermocouple locations are recommended to achieve proper attachment of SoM:

Note Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow.

The ConnectCore 8M Nano is approved to withstand a total of four (4) reflow cycles. Two (2) reflow cycles are required for manufacturing the ConnectCore 8M Nano. Two (2) reflow cycles are remaining for mounting the module on the carrier board. Digi strongly recommends soldering the ConnectCore 8M Nano during the last reflow cycles of the carrier board manufacturing process.