Reflow oven profile

• Keep SoM below 238°C during the reflow cycle for castellation AND LGA applications.
• Time Above Liquidous (TAL) is recommended to be between 30 to 45 seconds.
• Use of 40AWG K-type thermocouple and M.O.L.E or equivalent thermal profiler is recommended.

Two thermocouple locations are recommended to achieve proper attachment of SoM:

• For castellation applications, one thermocouple located on a castellation (preferable a power or ground castellation) and a second located near the underside center of the SOM to ensure SOM is not exposed to excessive temperatures.
• For LGA applications, one thermocouple located on the outer-most row (preferable a power or ground pad) and a second located near the underside center of the SOM to ensure SOM is not exposed to excessive temperatures.

Note Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow.

The ConnectCore 6UL module is approved to withstand a total of four (4) reflow cycles. Two (2) reflow cycles are required for manufacturing the ConnectCore 6UL module. Two (2) reflow cycles are remaining for mounting the module on the carrier board. Digi strongly recommends soldering the ConnectCore 6UL module during the last reflow cycles of the carrier board manufacturing process.