Reflow profile

Time Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. Use of 40AWG K-type thermal couple and M.O.L.E or equivalent thermal profiler is recommended. The first recommended thermal probe location is on the outer row of pads, to be on the out most row of pins preferably a ground pad. The second thermal probe location is on the inner row of pads preferably a signal pad.

The following image shows the reflow profile based on a ten-zone oven, with SAC 305 Lead-Free Solder Paste (Alpha OM-340).

The reflow profile shown above is valid for the combination solder paste/reflow machine and Digi reference carrier board. Optimization of a reflow profile will depend on the selected solder paste/reflow machine (reflow or vapor phase) and carrier board design.

The ConnectCore i.MX6 is approved to withstand a total of four reflow cycles. Two reflow cycles are required for manufacturing the ConnectCore i.MX6 SOM. Two (2) reflow cycles are remaining for mounting the module on the carrier board. Digi strongly recommends to solder the ConnectCore i.MX6 module during the last reflow cycles of the carrier board manufacturing process.