Recommended solder reflow cycle

The following table lists the recommended solder reflow cycle. The chart shows the temperature setting and the time to reach the temperature.

Time (seconds)	Temperature (°C)
30	65
60	100
90	135
120	160
150	195
180	240
210	260

The maximum temperature should not exceed 260 °C.

The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the device while the solder is molten, as parts inside the device can be removed from their required locations.

Hand soldering is possible and should be done in accordance with approved standards.

The XBee/XBee-PRO Zigbee RF Modules are level 3 Moisture Sensitive Devices. When using this kind of device, consider the relative requirements in accordance with standard IPC/JEDEC J-STD-020.

In addition, note the following conditions:

Calculated shelf life in sealed bag: 12 months at <40 °C and <90% relative humidity (RH).
Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD -033C, paragraphs 5 through 7.
The time between the opening of the sealed bag and the start of the reflow process cannot exceed 168 hours if condition b) is met.
Baking is required if conditions b) or c) are not met.
Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.
If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at 125 °C.