The low-power XBee S2C TH and XBee S2C devices have received South Korean approvals. To show conformity to the certificate, you must add a label with the South Korean product information to the XBee S2C DigiMesh RF Module.
For the through-hole device, you can place the label on the reverse side.
Recommended label material: Abraham Technical (700342) MFG P/N TAAE-014250.
The label size is: 15.9 mm x 15.9 mm (0.625 in x 0.625 in)
The complete label information is as follows:
The KCC logo must be at least 5 mm tall.
The text shown in the label is:
If the label size does not accommodate the required content, you can use abbreviated information, as follows:
The KCC logo must be at least 5 mm tall.
The text shown on the label is:
인증번호 : MSIP-CRM-DIG-XBee-S2C-TH
For the surface-mount version, the label will overlay the existing product label.
CAUTION! By placing a label over the existing label, the certifications for Europe (CE), Australia, New Zealand (RCM), and Japan will no longer apply.
Recommended label material: Abraham Technical TELT-000465.
The label size is: 15.9 mm x 20.3 mm (0.625 in x 0.8 in)
The complete label information is as follows:
The KCC logo must be at least 5 mm tall.
The text shown in the label is:
If the label size does not accommodate the required content, you can use the abbreviated information, as follows:
The KCC logo must be at least 5 mm tall.
The text shown in the label is:
인증번호 : MSIP-CRM-DIG-XBee-S2C